HSPL

Kemafoil® HSPL is a range of treated and heat stabilized polyester films with high surface tension and a very low residual shrinkage. They guarantee excellent dimensional stability and outstanding adhesion with conductive inks (carbon, silver, dielectric, etc), adhesives and lacquers. HSPL products are available also on VTM0 flame retardant base.
To meet the growing demand for eco-sustainable materials, Coveme has introduced Kemafoil®ECO films for the printed circuitry market, made with 70% recycled PET (rPET).
The Kemafoil®ECO with 70% rPET guarantee the same performance as the standard product, both in terms of the high surface tension and the very low level of shrinkage achieved.
The 70% of rPET comes from a recycling process in which post-consumer waste (plastic bottles, food trays, etc.) is recycled for the production of a rPET that has mechanical and physical properties comparable to those of virgin PET.

Main applications are: 

• TFC, Thin Flexible Circuitry
• RFID, Radio Frequency Identification
• FPCB, Flexible Printed Circuits boards
• FFC, Flat Flexible Cable
• MTS, Membrane Touch Switch
• Electro-Luminescent Surfaces
• NFC, Near Field Communication